Chip Packaging Engineering Manager
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Minimum qualifications:
- Bachelor's degree in Electrical Engineering, Computer Engineering, Computer Science, or a related field, or equivalent practical experience.
- 10 years of experience with package development for high volume production.
- 3 years of industry experience in engineering management.
Preferred qualifications:
- Master's degree or PhD in Electrical Engineering, Computer Engineering or Computer Science, with an emphasis on computer architecture.
- Experience in the thermal and mechanical modeling of silicon packaging.
- Experience with the qualification process for advanced silicon packaging.
- Familiarity with general package assembly process, packaging materials, and reliability requirements (component and board level).
- Knowledge in 2.5D and 3D packaging technologies for high performance computing.
About the job
Be part of a team that pushes boundaries, developing custom silicon solutions that power the future of Google's direct-to-consumer products. You'll contribute to the innovation behind products loved by millions worldwide. Your expertise will shape the next generation of hardware experiences, delivering unparalleled performance, efficiency, and integration.We are looking for an experienced packaging engineering manager who has strong leadership and project management experience, is detail oriented, and operationally focused.
In this role, you will lead multi-disciplinary teams throughout custom silicon development with special focus on package bill of materials (BOMs) design tradeoffs, assembly process evaluation, mechanical reliability and qualification and silicon characterization. You will have a strong track record delivering products into production and experience in post silicon validation and qualification.Behind everything our users see online is the architecture built by the Technical Infrastructure team to keep it running. From developing and maintaining our data centers to building the next generation of Google platforms, we make Google's product portfolio possible. We're proud to be our engineers' engineers and love voiding warranties by taking things apart so we can rebuild them. We keep our networks up and running, ensuring our users have the best and fastest experience possible.
Responsibilities
- Lead and manage a team developing high performance chip packages for Google TPUs.
- Provide technical mentorship on the thermal and mechanical aspects of package design.
- Drive advanced packaging solutions from concept to high volume production comprehending manufacturing, electrical, thermal and mechanical requirements.
- Drive collaboration with multi-functional internal teams, outsourced assembly and tests (OSATs) and material suppliers to deliver TPU chip package solutions for production.
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